cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 1/7 mtnk3n3 cystek product specification esd protected n-channel mosfet mtnk3n3 description ? low voltage drive, 1.8v ? easy to use in parallel ? high speed switching ? esd protected device ? pb-free lead plating and halogen-free package symbol outline ordering information device package shipping MTNK3N3-0-T1-G sot-23 (pb-free lead plating and halogen-free package) 3000 pcs / tape & reel sot-23 mtnk3n3 d g s g gate s source d drain bv dss 20v i d 100ma r dson 3 environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t1 : 3000 pc s / tape & reel,7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 2/7 mtnk3n3 cystek product specification absolute maximum ratings (ta=25 c) parameter symbol limits unit drain-source voltage bv dss 20 v gate-source voltage v gs 8 v continuous drain current i d 100 ma pulsed drain current i dm 400 *1 ma total power dissipation p d 300 mw esd susceptibility 350 *2 v operating junction and storage temperature range tj -55~+150 c thermal resistance, junction-to-ambient rth,ja 417 c/w note : *1. pulse width 300 s, duty cycle 2% *2. human body model, 1.5k in series with 100pf electrical characteristics (ta=25 c) symbol min. typ. max. unit test conditions static bv dss 20 - - v v gs =0, i d =100 a v gs(th) 0.5 - 1.0 v v ds =v gs , i d =250 a i gss - - d 1 a v gs = d 8v, v ds =0 i dss - - 500 na v ds =20v, v gs =0 - 1.7 3 v gs =4.5v, i d =100ma r ds(on) - 3.5 6 v gs =1.8v, i d =20ma g fs 100 - - ms v ds =5v, i d =100ma dynamic c iss - 23 50 c oss - 7.7 25 c rss - 5.8 5 pf v ds =10v, v gs =0, f=1mhz source-drain diode *v sd - - 1 v v gs =0v, i s =10ma *pulse test : pulse width 300 s, duty cycle 2%
cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 3/7 mtnk3n3 cystek product specification typical characteristics typical output characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 01234 vds, drain-source voltage(v) i d , drain current(a) v gs =1.5v 3.5v 4.5v 3v 1.8v 2.0v 2.5v 5v 4. 0 v typical transfer characteristics 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0123456 v gs , gate-source voltage(v) i d , drain current(a) v ds =3v static drain-source on-state resistance vs drain current 1 10 0.001 0.01 0.1 1 i d , drain current(a) r ds(on) , static drain-source on- state resistance() v gs =1.8v v gs =4.5v static drain-source on-state resistance vs gate-source voltage 0 1 2 3 4 5 6 7 024681 v gs , gate-source voltage(v) r ds(on) , static drain-source on- state resistance() 0 i d =100ma i d =20ma reverse drain current vs source-drain voltage 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 00.10.20.30 .4 i dr , reverse drain current(a) v sd , source-drain voltage(v) capacitance vs drain-to-source voltage 1 10 100 0.1 1 10 100 v ds , drain-source voltage(v) capacitance---(pf) c oss ciss crss
cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 4/7 mtnk3n3 cystek product specification typical characteristics(cont.) power derating curves 0 50 100 150 200 250 300 350 0 50 100 150 200 t a , ambient temperature() p d , power dissipation(mw) recommended soldering footprint
cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 5/7 mtnk3n3 cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 6/7 mtnk3n3 cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c447n3 issued date : 2010.08.18 revised date : 2013.10.23 page no. : 7/7 mtnk3n3 cystek product specification sot-23 dimension *:typical inches millimeters inches millimeters dim min. max. min. max. marking: dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0032 0.0079 0.08 0.20 b 0.0472 0.0669 1.20 1.70 k 0. 0118 0.0266 0.30 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1161 2.10 2.95 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0000 0.0040 0.00 0.10 l1 0. 0118 0.0197 0.30 0.50 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . style : pin 1.gate 2.source 3.drain 3-lead sot-23 plastic surface mounted package cystek package code: n3 k3 xx device code date code
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